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Bambu Lab - CyberBrick Time Lapse Hardware Kit PlateBond Température d'impression 260-300°C Plateau 45-60℃ Version:X1E Power Cooling Fan Rosa3D>PETG+CF 37 10 Élongation à G00-N00-1.75-1000-splfree

Editorial offset stage Wave · brackets
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Glass shelves · bracketed field sheets

Description

Bambu Lab CyberBrick Time Lapse Hardware Kit PlateBond Température d'impression 260 300°C Plateau 45 60℃ Version:X1E Power Cooling Fan Rosa3D>PETG+CF 37 10 Élongation à G00 N00 1.75 1000 splfree Température d'impression 260 300°C Plateau 45 60℃ (papier de masquage Avantages du TPU flexible :

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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